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Xilence

Xilence XZ018 Thermal Paste - 5.15 W/m·K, 1.5 g Syringe, -30 to 280°C (Boxed)

SKU 5770 Brand Xilence EAN13 4044953501067
High-performance Xilence XZ018 thermal paste with 5.15 W/m·K conductivity, 73 CPS viscosity, and low 0.201 °C/W resistance. Non-conductive, reliable from -30 to 280°C in a convenient 1.5g syringe for easy CPU application.
Cooling (CPU & Case) - Device Type Thermal Paste
Cooling (CPU & Case) - Socket Support Universal
Cooling (CPU & Case) - Color Silver / Grey

The Xilence XZ018 thermal paste delivers exceptional heat transfer with **5.15 W/m·K** conductivity, ensuring efficient cooling and lower CPU temperatures. Its low thermal resistance of 0.201 °C/W and viscosity of 73 CPS make it easy to apply evenly without mess.

Designed for reliability across extreme conditions, it operates continuously from **-30°C to 280°C** and is fully non-electrically conductive, preventing short circuits on high-end components. Ideal for small cases, the compact 1.5g syringe allows precise application even in tight spaces.

  • Thermal Conductivity: 5.15 W/m·K
  • Viscosity: 73 CPS
  • Thermal Resistance: 0.201 °C/W
  • Temperature Range: -30 to 280°C
  • Net Weight: 1.5 g
  • Non-conductive formula
Thermal conductivity5.15 W/m·K
Viscosity73 CPS
Thermal resistance0.201 °C/W
Operating temperature range-30 to 280 °C
Net weight1.5 g
Electrically conductiveNo
ColorGrey
Packaging1.5 g Syringe