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ICY BOX

IB-M2HSF-702 Heat Pipe Heatsink for M.2 SSD 22x80mm w/30mm Fan (Boxed)

SKU 62087 Brand ICY BOX EAN13 4250078170662
ICY BOX IB-M2HSF-702 is an active M.2 2280 SSD cooler with 2x4mm copper heat pipes, 9 aluminum fins, and 30mm 8500RPM fan. Reduces temps up to 50% (TDP 25W). Silver aluminum, includes thermal pads, 4-pin 12V connector. Mounting height 55mm.
Cooling (CPU & Case) - Device Type M.2 Heatsink
Cooling (CPU & Case) - Fan Size 40 mm
Cooling (CPU & Case) - Lightning None
Cooling (CPU & Case) - Connector 4-Pin PWM
Cooling (CPU & Case) - Color Silver / Grey

The ICY BOX IB-M2HSF-702 is a high-performance active cooling solution designed specifically for M.2 SSDs measuring 22x80mm (2280 form factor). Featuring a substantial aluminum heatsink with 9 cooling fins (0.5mm thick, 2mm air gaps), dual 4mm copper heat pipes (Cu1100, sintered structure with H2O fluid), and a silent 30x30x7mm fan spinning at 8500 RPM, this cooler efficiently dissipates up to 25W TDP. It connects via a standard 4-pin DC 12V motherboard header and can reduce SSD temperatures by up to 50% under heavy loads compared to passive solutions.

Made of high-grade silver aluminum with silicone thermal pads (1.5 W/mK conductivity, -20°C to 180°C range), the IB-M2HSF-702 ensures optimal heat transfer and compatibility across various SSD models. Installation requires 55mm mounting height clearance and is straightforward with included counter plate, thermal pads, and screwdriver. Ideal for high-performance NVMe drives in gaming PCs or workstations where thermal throttling is a concern.

  • Key Benefits: Up to 50% temperature reduction*, 25W TDP capacity, direct SSD contact heat pipes
  • Fan Specs: 4.87 m³/h airflow, 70mA (max 90mA), no PWM speed control
  • Compatibility: M.2 2280 SSDs max 80mm length, 4-pin 12V header required
  • Includes: Heatsink, fan, 2x thermal pads, counter plate, screwdriver
  • *Depends on SSD manufacturer, model, version, and workload
MPNIB-M2HSF-702
EAN4250078170662
ColorSilver
MaterialAluminium
M.2 Card Size22x80 mm
Cooling TypeHeat pipe with 30 mm fan
Thermal Pad MaterialSilicone
Thermal Conductivity1.5 W/mK
Thermal Pad Temp Range-20°C ~ 180°C
Heat Pipes2x 4 mm copper (Cu1100)
Heatpipe StructureSinter
Heatpipe FluidWater (H2O)
Cooling Fins9 (0.5 mm thick, 2.0 mm air gap)
TDP25W
Fan Dimensions30 x 30 x 7 mm
Fan Speed8500 rpm (no speed adjustment)
Fan Current70 mA (max. 90 mA)
Fan Connector4-PIN DC 12 V
Air Flow4.87 m³/h (2.87 CFM)
Mounting Height55 mm
System RequirementsM.2 SSD max 80 mm, one 4-PIN DC 12 V port
Temperature ReductionUp to 50%*