Intel Core i9-10900X - LGA2066 - 10-Core/20-Thread, 3.7 GHz (4.7 GHz Turbo), 165W, DDR4 Quad-Channel
Intel Core i9-10900X (LGA2066) 10 cores / 20 threads, 3.7 GHz base up to 4.7 GHz Turbo, 165W TDP, DDR4 quad-channel memory support for HEDT desktop systems.
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| CPU (Processors) - Series / Family | Intel Core i9 |
|---|---|
| CPU (Processors) - Cores | 10 |
| CPU (Processors) - Threads | 20 |
| CPU (Processors) - Memory Support | DDR4 |
Intel Core i9-10900X. Processor family: Intel® Core™ i9 X-series. Processor socket: LGA 2066 (Socket R4). Processor lithography: 14 nm. Memory channels: Quad-channel. Maximum internal memory supported by processor: 256 GB. Memory types supported by processor: DDR4-SDRAM. Market segment: Desktop. Supported instruction sets: SSE4.1. SSE4.2. AVX 2.0. AVX-512. Scalability: 1S. Intel® Turbo Boost Max Technology 3.0 frequency: 4.7 GHz. Package width: 44 mm. Package depth: 116 mm. Package height: 101 mm
| Processor manufacturer | Intel |
| Processor generation | 10th gen Intel® Core™ i9 |
| Processor model | i9-10900X |
| Processor base frequency | 3.7 GHz |
| Processor family | Intel® Core™ i9 X-series |
| Processor cores | 10 |
| Processor socket | LGA 2066 (Socket R4) |
| Component for | PC |
| Processor lithography | 14 nm |
| Processor threads | 20 |
| System bus rate | 8 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 4.5 GHz |
| Processor cache | 19.25 MB |
| Processor cache type | Smart Cache |
| Thermal Design Power (TDP) | 165 W |
| Package type | Box |
| Generation | 10th Generation |
| Memory bandwidth supported by processor (max) | 94 GB/s |
| Processor codename | Cascade Lake |
| Processor ARK ID | 198019 |
| Maximum internal memory supported by processor | 256 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2933 MHz |
| Memory channels | Quad-channel |
| On-board graphics card model | Not available |
| Discrete graphics card model | Not available |
| Feature | Intel® Deep Learning Boost (Intel® DL Boost) on CPU |
| Market segment | Desktop |
| Maximum number of PCI Express lanes | 48 |
| PCI Express slots version | 3.0 |
| Supported instruction sets | SSE4.1. SSE4.2. AVX 2.0. AVX-512 |
| Scalability | 1S |
| CPU configuration (max) | 1 |
| Thermal solution specification | PCG 2017X |
| PCI Express CEM revision | 3.0 |
| Export Control Classification Number (ECCN) | 5A992C |
| Commodity Classification Automated Tracking System (CCATS) | G077159 |
| Intel® Turbo Boost Technology | 2.0 |
| Intel® Turbo Boost Max Technology 3.0 frequency | 4.7 GHz |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Tjunction | 94 °C |
| Target market | Gaming. Content Creation |
| Launch date | Q4'19 |
| Product type | Processor |
| Status | Launched |
| Maximum memory | 256 GB |
| Supported memory types | DDR4-SDRAM |
| Bus speed | 8 GT/s DMI3 |
| Harmonized System (HS) code | 8542310001 |
| Package width | 44 mm |
| Package depth | 116 mm |
| Package height | 101 mm |
| Package weight | 87 g |
| Maximum internal memory | 256 GB |